Part Number Hot Search : 
ER801F T211029 DTC144E PL002 C107M Z27VC DR2AR SA103
Product Description
Full Text Search
 

To Download HD74CBTS16212A Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 To all our customers
Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp. Customer Support Dept. April 1, 2003
Cautions
Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
HD74CBTS16212A
24-bit FET Bus-Exchange Switches with Schottky diode clamping
ADE-205-680 (Z) Preliminary Rev. 0 Feb. 2002 Description
The HD74CBTS16212A devices provide 24-bits of high speed TTL-compatible bus switching or exchanging. The low on state resistance of the switch allows connections to be made with minimal propagation delay. Each device operates as a 24-bit bus switch or a 12-bit bus exchanger that provides data exchanging between the four signal ports via the data-select (S0, S1, S2) terminals.
Features
* Minimal propagation delay through the switch. * 5 switch connection between two ports. * TTL-compatible input levels. * Ultra low quiescent power. -Ideally suited for notebook applications. * Package type Product code example: HD74CBTS16212ATEL
Package type TSSOP-56pin Package code TTP-56DAV Package suffix T Taping code EL(1,000pcs / Reel)
HD74CBTS16212A
Function Table
Inputs S2 L L L L H H H H H: L: Z: S1 L L H H L L H H High level Low level High impedance S0 L H L H L H L H Inputs / Outputs A1 Z B1 port B2 port Z Z Z B1 port B2 port A2 Z Z Z B1 port B2 port Z B2 port B1 port Function Disconnect A1 port = B1 port A1 port = B2 port A2 port = B1 port A2 port = B2 port Disconnect A1 port = B1 port A2 port = B2 port A1 port = B2 port A2 port = B1 port
Rev.0, Feb. 2002, page 2 of 2
HD74CBTS16212A
Pin Arrangement
S0 1 1A1 2 1A2 3 2A1 4 2A2 5 3A1 6 3A2 7 GND 8 4A1 9 4A2 10 5A1 11 5A2 12 6A1 13 6A2 14 7A1 15 7A2 16 VCC 17 8A1 18 GND 19 8A2 20 9A1 21 9A2 22 10A1 23 10A2 24 11A1 25 11A2 26 12A1 27 12A2 28
56 S1 55 S2 54 1B1 53 1B2 52 2B1 51 2B2 50 3B1 49 GND 48 3B2 47 4B1 46 4B2 45 5B1 44 5B2 43 6B1 42 6B2 41 7B1 40 7B2 39 8B1 38 GND 37 8B2 36 9B1 35 9B2 34 10B1 33 10B2 32 11B1 31 11B2 30 12B1 29 12B2
(Top view)
Rev.0, Feb. 2002, page 3 of 3
HD74CBTS16212A
Absolute Maximum Ratings
Item Supply voltage range Input voltage range Input clamp current Continuous output current Continuous current through VCC or GND Maximum power dissipation *2 at Ta = 25C (in still air) Storage temperature Notes:
*1
Symbol VCC VI IIK IO ICC or IGND PT Tstg
Ratings -0.5 to 7.0 -0.5 to 7.0 -50 128 100 1.32 -65 to 150
Unit V V mA mA mA W C
Conditions
VI < 0 VO = 0 to VCC
The absolute maximum ratings are values which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. 1. The input and output voltage ratings may be exceeded even if the input and output clamp-current ratings are observed. 2. The maximum package power dissipation was calculated using a junction temperature of 150C.
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Input transition rise or fall rate Operating free-air temperature Symbol VCC VI VI/O t / v Ta Min 4.0 0 0 0 -40 Max 5.5 5.5 5.5 5 85 Unit V V V ns / V C VCC = 4.5 to 5.5 V Conditions
Note: Unused or floating inputs must be held high or low.
Rev.0, Feb. 2002, page 4 of 4
HD74CBTS16212A
Block Diagram
1A1
2 54
1B1
1A2 * * * 12A1
3
53
27
30
1B2 * * * 12B1
12A2
28
29
12B2
S0
1
S1
56
S2
55
Rev.0, Feb. 2002, page 5 of 5
HD74CBTS16212A
DC Electrical Characteristics
(Ta = -40 to 85C)
Item Clamp diode voltage Input voltage Symbol VIK VIH VIL On-state switch *2 resistance RON VCC (V) 4.5 4.0 to 5.5 4.0 to 5.5 4.0 Min 2.0 Typ 14
*1
Max -1.2 0.8 20
Unit V V
Test conditions IIN = -18 mA
VIN = 2.4 V, IIN = 15 mA Typ at VCC = 4.0 V VIN = 0 V, IIN = 64 mA VIN = 0 V, IIN = 30 mA VIN = 2.4 V, IIN = 15 mA
4.5 4.5 4.5 Input current Off-state leakage current IIN IOZ 0 to 5.5 5.5 5.5 Quiescent supply current Increase in ICC *3 per input Notes: ICC ICC 5.5 5.5
-1.0
4 4 6
7 7 12 1.0 20 3 2.5 A mA A A
VIN = 5.5 V or GND control inputs VO = GND A or B VO = 5.5 V A or B VIN = VCC or GND, IO = 0 mA One input at 3.4 V, other inputs at VCC or GND
For condition shown as Min or Max use the appropriate values under recommended operating conditions. 1. All typical values are at VCC = 5 V (unless otherwise noted), Ta = 25C. 2. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower voltage of the two (A or B) terminals. 3. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
Rev.0, Feb. 2002, page 6 of 6
HD74CBTS16212A
Capacitance
(Ta = 25C)
Item Control input capacitance Input / output capacitance Symbol CIN CI/O (OFF) VCC (V) 5.0 5.0 Min Typ 5 11 Max Unit pF pF Test conditions VIN = 0 or 3 V VO = 0 or 3 V S0, S1, or S2 = VCC
Note: This parameter is determined by device characterization is not production tested.
Switching Characteristics
(Ta = -40 to 85C) * VCC = 4.0 V
Symbol tPLH tPHL tPLH tPHL tZH tZL tHZ tLZ Min Max 0.35 10.0 10.4 9.2 Unit ns ns ns ns Test conditions CL = 50 pF RL = 500 CL = 50 pF RL = 500 CL = 50 pF RL = 500 CL = 50 pF RL = 500 FROM (Input) A or B S S S TO (Output) B or A A or B A or B A or B
Item Propagation delay *1 time Propagation delay time Enable time Disable time
*
VCC = 5.00.5 V
Symbol tPLH tPHL tPLH tPHL tZH tZL tHZ tLZ Min 1.5 1.5 1.5 Max 0.25 9.1 9.7 8.8 Unit ns ns ns ns Test conditions CL = 50 pF RL = 500 CL = 50 pF RL = 500 CL = 50 pF RL = 500 CL = 50 pF RL = 500 FROM (Input) A or B S S S TO (Output) B or A A or B A or B A or B
Item Propagation delay *1 time Propagation delay time Enable time Disable time
Note:
1. The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
Rev.0, Feb. 2002, page 7 of 7
HD74CBTS16212A
Test Circuit
See under table 500 S1 OPEN GND
*1
CL = 50 pF
500
Load circuit for outputs Symbol t PLH / tPHL t ZH / t HZ t ZL / t LZ S1 OPEN OPEN 7V
Note: 1. CL includes probe and jig capacitance.
Rev.0, Feb. 2002, page 8 of 8
HD74CBTS16212A
Waveforms - 1
tr 90 % Input 10 % t PLH 1.5 V 90 % 1.5 V 10 % t PHL V OH Output 1.5 V 1.5 V V OL GND tf 3V
Waveforms - 2
tf 90 % Output Control 1.5 V 10 % t ZL 10 % t LZ 3.5 V Waveform - A 1.5 V V OL + 0.3 V t ZH t HZ V OH - 0.3 V 1.5 V GND Notes: 1. All input pulses are supplied by generators having the following characteristics : PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. 2. Waveform - A is for an output with internal conditions such that the output is low except when disabled by the output control. 3. Waveform - B is for an output with internal conditions such that the output is high except when disabled by the output control. 4. The output are measured one at a time with one transition per measurement. V OL V OH tr 90 % 1.5 V GND 3V
Waveform - B
Rev.0, Feb. 2002, page 9 of 9
HD74CBTS16212A
Package Dimensions
As of July, 2001
14.0 14.2 Max
Unit: mm
29
56
1
*0.19 0.05
0.50
28
0.08 M
8.10 0.20
0 - 8
6.10
1.0
0.65 Max
*0.15 0.05
0.10
0.10 0.05
1.20 Max
0.50 0.1
*Pd plating
Hitachi Code JEDEC JEITA Mass (reference value)
TTP-56DAV -- -- 0.32 g
Rev.0, Feb. 2002, page 10 of 10
HD74CBTS16212A
Disclaimer
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Sales Offices
Hitachi, Ltd.
Semiconductor & Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109
URL
http://www.hitachisemiconductor.com/
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Europe GmbH Electronic Components Group Dornacher Strae 3 D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Asia Ltd. Hitachi Tower 16 Collyer Quay #20-00 Singapore 049318 Tel : <65>-538-6533/538-8577 Fax : <65>-538-6933/538-3877 URL : http://semiconductor.hitachi.com.sg Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road Hung-Kuo Building Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : http://semiconductor.hitachi.com.hk
Copyright (c) Hitachi, Ltd., 2002. All rights reserved. Printed in Japan.
Colophon 5.0
Rev.0, Feb. 2002, page 11 of 11


▲Up To Search▲   

 
Price & Availability of HD74CBTS16212A

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X